AMTECH VS-213A TF Amount:3 helps prevent slumping

helps prevent slumping

its chemical and thermal stability

nonflammability and low toxicity make it useful for other industrial applications such as specialty solvent and heat transfer applications

The core provides sufficient activity to solder successfully to bare copper and other hard-to-solder surfaces

Electrochemical Migration

AMTECH VS-213A TF Amount:3 helps prevent slumpingDOWNLOADS Technical Data Sheet Safety Data Sheet PRODUCT INFO Product Highlights: ROL0 flux classification No Clean tacky flux Optimized for Lead free and standard allow systems Designed for LGA, BGA & CSP components Halogen free oer EN14582 test method Clear residue Low voiding Excellent wetting compatibility on most board finishes REACH compliant Available Alloys Alloy Temp C Temp F 63Sn 37Pb 183 361 62Sn 36Pb 2Ag 179 354 62. 8Sn 36. 8Pb 0. 4Ag 179