DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide Diabrasive Premium Diamond Suspension is

Diabrasive Premium Diamond Suspension is designed for intermediate and final polishing operations during metallographic specimen preparation

Ensure consistency in your materials preparation results with CarbiPro

stainless steels

designed for fast material removal and excellent flatness during coarse polishing steps

240 Grit / P280 Grit rating

DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide Diabrasive Premium Diamond Suspension isThe DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 4in x 0. 016in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 4in (100mm) Thickness: 0. 016in (0. 4mm) Arbor: 0. 5in (12. 7mm) Item No DS 1004 1 pkg